Why Phenoxy Resin (CAS 26402-79-9) Is the Preferred Binder in PCB Ink and Electronic Component Protection
Printed circuit board manufacturing demands materials that can withstand solder heat, resist moisture, maintain electrical insulation, and bond reliably to copper, glass fiber, and substrate laminates. Phenoxy Resin (CAS 26402-79-9), also known as Poly(bisphenol A-co-epichlorohydrin), has become a core material in phenoxy resin PCB ink systems precisely because it meets this combination of requirements without the processing complications of fully reactive thermoset systems.
2026-06
2026-06-29